Researchers demonstrate scalable integration of graphene and GaN devices using van der Waals forces, enabling ...

When materials are created on a nanometer scale—just a handful of atoms thick—even the thermal energy present at room ...

Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform includes an interposer which supports chiplets using UCIe-A for die-to-die interconnects, allowing ...

Sarcina Technology, a global semiconductor packaging specialist, has launched its AI platform to enable advanced AI packaging ...