Now, a team of researchers led by Professor Huang Xian from the School of Precision Instrument and Opto-electronics ...

FormFactor's advanced wafer probe cards make contact with microscopic chip connections to verify functionality before chips are packaged -- catching defects early when they're cheapest to fix. Q1 2025 ...

Tianjin University scientists have developed a pioneering nondestructive testing technology for micro-LED wafers, offering a much-needed solution to a long-standing industry challenge through a ...

The introduction of the double-sided wafer probe test cell is expected to have a significant impact on the silicon photonics and CPO market. By enabling high-throughput electro-optical testing of ...

In the field of pan semiconductor, precision machined industrial ceramic parts have become a key factor driving industry ...

Conventional testing approaches face major limitations, with some methods damaging wafer surfaces irreversibly, while others ...

In this paper, we present the mechanical and electrical details of a wafer-level test infrastructure designed for higher parallel testing of system-on-chips (SoCs). In previous test infrastructures, a ...

Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce the availability of the ...

The introduction of the double-sided wafer probe test cell is expected to have a significant impact on the silicon photonics and CPO market.