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TSMC to go 3D with wafer-sized processors — CoW-SoW technology allows 3D stacking for the world's largest chips
At its North American Technology Symposium, it introduced its next-generation system-on-wafer platform—CoW-SoW—that will enable 3D integration with wafer-scale designs. This builds on the InFO ...
Semiconductor Engineering1d
The Rise Of Thin Wafer Processing
From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...