Direct wafer bonding of wafers is now well establish. However in many interesting applications, direct bonding of die to wafer can lead to innovative devices. After explaining some specific ...

The low-cost, scalable technology enables seamless integration of high-speed gallium nitride transistors onto a standard ...

🌏 WorldGen can generate 3D scenes in seconds from text prompts and images. It is a powerful tool for creating 3D environments and scenes for games, simulations, robotics, and virtual reality ...

300mm Si wafer-scale oxide fusion bonding and mechanical/wet etch assisted wafer thinning processes were combined with a TSV-last 3D integration strategy to fabricate electrical open/short yield ...