TSMC has already made a system-on-wafer for Tesla's Dojo supercomputer, but this version does not offer the kind of 3D-stacking with logic and memory the company has in mind for the next version ...

As semiconductor technology scales down in size, process integration complexity and defects are increasing in 3D NAND flash, partially due to larger stack deposits and thickness variability between ...

Graphcore has launched the world’s first 3D Wafer-on-Wafer processor - the Bow IPU - which will be at the heart of the company’s next generation Bow Pod AI computer system. The computer system, which ...

Invensas to Exhibit Low Temperature Wafer Bonding and 3D Interconnect Solutions at IWLPC 2016. October 17, 2016 08:00 AM Eastern Daylight Time. SAN JOSE, Calif.-- ...

Prototype modules featuring 1366 Technologies’ 3D direct wafers were on show this week at the SNEC show in Shanghai, the fruit of a partnership between the U.S-based wafer startup and module ...

Wafer-to-wafer bonding is a crucial process step to enable 3D stacked devices. However, tight alignment and overlay accuracy between the wafers is required to achieve good electrical contact between ...

Say you wanted to create a chip in which a processor fabricated in 32-nm process rules would be combined with memory done on a 65-nm process and analog blocks fabricated at 180 ...

Chip makers Intel, Samsung Electronics and Taiwan Semiconductor Manufacturing Co. announced Monday that they will collaborate to move chip manufacturing onto larger silicon wafers by 2012.

Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...

Graphcore has launched the world’s first 3D Wafer-on-Wafer processor - the Bow IPU - which will be at the heart of the company’s next generation Bow Pod AI computer system. The computer system, which ...