Working arrays were cut from the wafer and mounted in a lead frame, bonded with gold wires, and fiat lux. The whole thing must have been a great experience in modern fab methods, and [emach1ne ...

“Given the high scalability of plasma-epi and its compatibility with conventional semiconductor process, the proposed bottom-up wafer fabrication process will open a new route to developing ...

UMC announced the opening ceremony for its expanded facility in Singapore. The first phase of this new plant is scheduled to ...

TL;DR: TSMC plans to start mass production of its A16 process node in Taiwan by 2026 ... In a new report from UDN, we're learning that TSMC's first wafer fab in Arizona has begun mass production ...