AIXTRON SE (FSE: AIXA) to supply Nokia with its G10-AsP system. The G10-AsP will enable Nokia to produce 6-inch Indium Phosphide (InP) wafers, marking a significant milestone in the evolution of ...
More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.
OpenLight, the world leader in custom PASIC chip design and manufacturing, today announced a new ecosystem partnership with ...
It is also the most advanced machine for sale. The firm’s expertise has placed it at the centre of a global technology battle. To prevent China from building whizzy AI chips, the United States has ...
Achieving integration of semiconducting and superconducting qubits with full industrial 300-mm wafer fabrication.
If Trump does implement tariffs on chips, it raises a number of key questions, ranging from whether he places a tariff on the ...
The integration and miniaturization of amplifiers and oscillators, crucial for modern electronics, are achieved through ...
The EUV lithography Market report, unveiled by Future Market Insights—an ESOMAR Certified Market Research and Consulting Firm—presents invaluable insights and meticulous analysis of the EUV ...
Tom's Hardware on MSN5d
China's SiCarrier challenges U.S. and EU with full-spectrum of chipmaking equipment — Huawei-linked firm makes an impressive debutHuawei-linked Chinese startup has developed a nearly complete suite of semiconductor manufacturing tools to enable fully domestic chip production amid escalating export controls.
X-FAB Silicon Foundries, SMART Photonics, and Epiphany Design are developing a heterogeneous photonics integration platform ...
A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level ...
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