Calibre 3DStress from Siemens Digital delivers the early analysis and simulation of chip/package interactions at all stages ...

Discover why Applied Materials is poised to thrive in the AI-driven semiconductor boom with steady growth, strong cash flows, ...

Researchers have developed a blood test that detects Alzheimer's biomarkers at single-molecule levels, enabling earlier, ...

Apple is considering LG Innotek's chip-on-film (CoF) technology for future iPad Pro OLED displays, a change that could ...

Key milestones in GaN RF technology include unveiling the first Ka-band GaN MMIC power amplifier at the 2004 IEEE International Microwave Symposium, the first W-band GaN MMIC power amplifier at the ...

Two software tools, Innovator3D IC and Calibre 3DStress, address chiplet integration and thermal management at the transistor ...

The experiment involving one and two qubits was led by Dr Sam Bartee, and Dr Kushal Das was the lead designer of the control ...

Analog and mixed signal content is adding risk to ASIC designs. Pessimists see the problem getting worse, while optimists point to AI and chiplets for relief.

The Innovator3D IC solution suite has been developed to enable IC designers to author, simulate and manage heterogeneously ...

Source: IEEE ECTC [3] The 2nm gate-all-around transistor structure of the application processor with backside power delivery network required a 20% improvement in thermal dissipation through the block ...

Low-latency audio components and advanced DSP components plus algorithms enable active noise cancellation in discerning ...