Despite TSMC estimating that the mass production of silicon photonic (SiPh) co-packaged optics (CPO) technology will still ...

During its WWDC 2020 keynote, Apple officially confirmed its transition from Intel chips to its own Apple Silicon for the Mac. In addition to details for developers, Tim Cook announced that the ...

UMC 0.162um GII Logic process true 3.3V standard BOAC IO Cell Library (0.18um shrink process).

UMC 28nm Logic and Mixed-Mode HLP/RVT process 1.8V BOAC IO Cell Library (with customized PU/PD function).

Earthing and bonding are two very different, but often confused, methods of preventing electric shock. The principal of earthing is to limit the duration of touch voltages if you were to make contact ...

Dynasty Warriors Origins has a character bonding feature, where the original protagonist Ziluan can build close friendships with most of the game’s unique characters. The Yellow Turbans ...

Of particular note is the demonstrably smooth transition between classical covalent bonding and electron-rich multi-center bonding. Covalent bonding is seen, for example, in semiconductors such as ...

Over the past few years, photovoltaic (PV) technologies have become increasingly widespread, contributing to the ongoing quest to reduce greenhouse gas emissions. While most solar cells on the market ...

A new technical paper titled “3D integration of pixel readout chips using Through-Silicon-Vias” was published by researchers at CERN, IZM Fraunhofer and University of Geneva. “Particle tracking and ...

During extrusion process, the reactive epoxy groups interacted with the free terminal hydroxy and carboxy derived from the PBT, forming covalent bonds at the interface of FR and PBT, thereby enhancing ...

Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) and US-based artificial intelligence (AI) chip designer Nvidia Corp have partnered with each other on silicon photonics development, Nvidia founder ...