Semiconductor Engineering16h
Wafer-Scale Computing for LLMs (U. of Edinburgh, Microsoft)
A Wafer-Scale LLM Inference System” was published by researchers at University of Edinburgh and Microsoft Research. Abstract ...
LQDX and Arizona State University Sign Semiconductor Packaging Collaboration Agreement
LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that ...
Compoundsemiconductor.net7d
Gaining greater insight into the epitaxial process
For the growth of thin films, the introduction of instrumentation began with ‘traditional’ pressure and temperature measurement sensors. This has now expanded to include optical techniques – both ...
TSMC prepares to pass tariffs costs, could increase semiconductor prices by 15 percent
Commercial Times reports that TSMC might increase the prices of its most advanced semiconductor wafers by up to 15 percent this year. Rising production costs and ...
ACM Research: A WFE National Champion
ACM Research is a promising investment opportunity with strong growth prospects and undervalued potential. Click here to read ...
Semiconductor Engineering3d
STATS ChipPAC
STATS ChipPAC is an outsourced semiconductor assembly and test provider based in Singapore. The company was started in 1994. It provides wafer bump, probe and assembly, advanced wafer bump technology, ...
siliconsemiconductor14d
IQE and Quintessent partner on Quantum Dot for AI
Partners establish commercial quantum dot epitaxial wafer supply chain for AI optical interconnects.