The company expects the project to generate hundreds of billions of dollars in semiconductor value for AI and other ...

The facility will combine 300mm research and prototyping for front-end manufacturing and packaging capabilities, meeting a unique need for advanced packaging R&D within the U.S. semiconductor ...

Alpha & Omega Semiconductor Ltd. engages in the construction and operation of power semiconductor packaging, testing, and wafer fabrication facilities. It operates through the following ...

The facility will house 12-inch (300mm) industry-grade tools that enable faster production and cost savings, and will be used ...

RRP Electronics has announced plans to build a Rs 24,000 crore semiconductor fabrication unit and a Rs 12,035 crore phase 1 ...

President Trump and Taiwan Semiconductor Manufacturing announced a $100 billion company investment in Phoenix. The deal could have broad significance.

Sachin Tendulkar-backed RRP Electronics partners with Deca Technologies to enhance semiconductor packaging capabilities and ...

TSM weighing $100B investment in US chip plants, Trump may announce. Biden admin urges TSM to move advanced production to US ...

Semiconductor firms in Singapore can tap on a new S$500-million fabrication facility by 2027. The R&D facility in Tampines will focus on advanced packaging technologies, which is a key growth area. Th ...

TAIPEI, Taiwan — Taiwan’s president and top chipmaker TSMC held a joint news conference Thursday to defend the company’s ...