Amkor, an Arizona-based company, plans to invest $2 billion in the northwest Valley by building a state-of-the-art facility.

Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four new national awards announced by ...

TSM's 2025 CapEx expected at $38B-$42B, with increased focus on advanced packaging as AI and 3nm tech drive growth. Brand New Membership Level: Benzinga Trade Alerts Taiwan Semiconductor guided ...

Alpha & Omega Semiconductor Ltd. engages in the construction and operation of power semiconductor packaging, testing, and wafer fabrication facilities. It operates through the following ...

ACM Research is a promising investment opportunity with strong growth prospects and undervalued potential. Click here to read ...

Nvidia’s Blackwell AI chip leverages Taiwan Semiconductor’s CoWoS advanced packaging technology. Also Read: Taiwan Semiconductor Q4 Earnings: 3nm and 5nm Nodes Lead Topline Growth, Expands ...

It’s actually increasing capacity into CoWoS-L.” Nvidia’s foray into new technology is a stark reminder of how quickly advanced packaging needs are changing. Apparently, the semiconductor industry is ...

Kaynes SemiCon, a fully owned subsidiary of Kaynes Technology India, has emphasized the value of legacy semiconductor packages ... specializing in packaging operations (OSAT), aims to combine ...

Semiconductor Engineering believes that 2025 could be one ... “You can expect additional packaging houses to join the chiplet ecosystem and help standardize many aspects of design, and collaboration.

As the demand for AI processors continues to grow, the development of semiconductor packaging services becomes increasingly important. SPIL's expertise and capability in supporting advanced ...

AI is exceptionally good at spotting anomalies in semiconductor inspection ... Different textures in backgrounds are difficult for traditional algorithms, for example. But once machine learning models ...