According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to increase from USD 53.48 billion in 2026 to nearly USD 114.28 billion by 2034, ...

A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, ...

As the scale of artificial intelligence (AI) models grows rapidly, securing the performance of memory semiconductors has ...

Quantum Materials Market to Hit USD 96.9 Billion by 2032 as the Race for Quantum Computing, Next-Gen Semiconductors, and Topological Electronics Accelerates Globally ...

Wafer-scale transfer of 2D materials by bonding–debonding. a, Schematic illustration of the bonding and debonding process. b, ...

Most modern semiconductors are fabricated of or on silicon (Si), but as devices get smaller and denser, they dissipate more ...

Wave Photonics, in collaboration with Cardiff University, has announced an initiative to establish a pilot manufacturing line ...

Chinese researchers develop a direct wafer bonding method for 2D semiconductors, enabling smaller, faster electronics.

This week's cover of the international journal 'Science' features electrodes connected to a hydrogel, a soft polymer material ...

Amid a surge in data storage demand driven by the artificial intelligence (AI) boom, Samsung Electronics has developed a ...

Trade restrictions on rare-earth elements by China's government have spurred ingenuity from other countries and industries ...

Korean researchers revealed that efficiency losses in heterojunction solar cells arise from two coexisting defect types - dangling bonds and weak silicon-silicon bonds. Their findings explain how ...