Tesla's Terafab project launches in 7 days, targeting 2nm chips, $25B investment, and 1M monthly wafer starts by 2030.
Morning Overview on MSN
Drone strikes shut Qatar helium plant, cutting about 30% of supply
Drone strikes linked to the Iran conflict have knocked Qatar’s primary helium plant offline, removing roughly 30 percent of the world’s supply from the market in a single blow. The shutdown has sent ...
In connected car news are Wolfspeed announced the deployment of its 300mm silicon carbide (SiC) technology platform as a material foundation for advanced artificial intelligence (AI) and ...
The Chosun Ilbo on MSN
TSMC widens foundry lead over Samsung Electronics
Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest foundry (semiconductor contract manufacturer), widened its ...
Hengtai Leading Technology, a precision metal fabrication manufacturer established in 2012, has announced the continued ...
TAOYUAN, March 12, 2026 /PRNewswire/ -- A leading semiconductor advanced packaging equipment manufacturer Manz Asia today announced a strategic partnership with Seiko Epson Corporation (Epson) aimed ...
As the region moves up the chip value chain – toward AI development, advanced logic, and high-bandwidth memory – U.S. regulatory pressures increase.
Lam Research is a high-quality, shareholder-friendly semiconductor equipment leader, but current valuation is stretched. Find out why LRCX stock is a sell.
According to a report from Korea JoongAng Daily, the Taylor, Texas, fab has been delayed with pilot production now slated to be completed by the end of 2026. Pilot production is considered a major ...
Micron has come a long way since its humble founding nearly half a century ago in the basement of a Boise dental office, where sedative gas wafted through the floorboards and an early executive used a ...
Amtech Systems is a hold, reflecting its expansion into high-margin advanced packaging and a debt-free balance sheet through 2026. Click for more on ASYS stock.
Joint R&D programs focused on advancing materials engineering and advanced packaging innovations for next-generation DRAM and high-bandwidth ...
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