Rigorous testing is still required, but an abstraction layer can significantly reduce errors in the fab while optimizing ...

Photo imageable dielectric materials could replace the laser drilled build-up film via process used in glass substrates.

Researchers from Lam Research, the University of Colorado Boulder, and PPPL significantly boosted cryogenic reactive ion etching for 3D NAND by using hydrogen fluoride plasma, doubling the etch rate.