Offering four and six MOSFETs, respectively, in the low profile MAACPAK PressFit package, the Vishay Semiconductors ...
The Vishay Semiconductors VS-MPY038P120 and VS-MPX075P120 combine the latest SiC technology with a rugged transfer mould ...
Wafer-scale transfer of 2D materials by bonding–debonding. a, Schematic illustration of the bonding and debonding process. b, ...
Chinese researchers develop a direct wafer bonding method for 2D semiconductors, enabling smaller, faster electronics.
Quantum computers, systems that process information leveraging quantum mechanical effects, have the potential of ...
Infineon Technologies AG is navigating a challenging macro environment, aiming to expand in AI and data center markets. See ...
Two-dimensional (2D) van der Waals (vdW) ferromagnets are thin and magnetic materials in which molecules or layers are held together by weak attractive forces known as vdW forces. These materials have ...
StockStory.org on MSN
1 Value Stock Worth Your Attention and 2 We Turn Down
Value stocks typically trade at discounts to the broader market, offering patient investors the opportunity to buy businesses ...
For Medium to High Frequency Applications, Low Profile Devices Save Space While Reducing Parasitic Inductance for Cleaner ...
Wondering if Arm Holdings is a hidden bargain or just hype? Let’s dig into what’s really driving its price and where value ...
Tech Xplore on MSN
Direct approach can bond and debond 2D semiconductors without any glue-like materials
A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, performance and efficiency. Two-dimensional (2D) semiconductors, single-layer and ...
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