E&R (E&R Engineering Corp.), a Taiwan-based semiconductor equipment manufacturer with 30 years of expertise, has supplied over 500 advanced semiconductor packaging tools to major OSATs worldwide, ...

Rigorous testing is still required, but an abstraction layer can significantly reduce errors in the fab while optimizing ...

Breaking complex chips into smaller pieces allows for much more customization, particularly for domain-specific applications, ...

APT’s net profit expanded 24.5 percent to NT$607.62 million during the first three quarters of last year, compared with ...

Use precise geolocation data and actively scan device characteristics for identification. This is done to store and access information on a device and to provide personalised ads and content, ad and ...

YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With ...

Instead, glass substrates excel in resistance to heat and warpage, while allowing more chips to be stacked on ... This results in semiconductor speeds increasing by up to 40 percent, while power ...

Competition for an early lead in glass substrates for computer chip manufacturing is heating up, with component firms ...

The breakthrough will help substantially drive the market for GaN-based power semiconductors. According to Infineon, chip production on 300-mm wafers ... resulting in suppressed warpage and cracking.

“These awards are given based on the potential impact of the work on design and manufacturing of semiconductor ... to potential warpage. This paper describes the use of thermocompression bonding to ...

The Trump White House is demanding that government workers hunt for words like “immigrant” and “diversity” in billions of ...