The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley.

a group of 12 semiconductor suppliers focused on developing next-generation semiconductor advanced packaging and back-end processing technologies. Founded in 2023 by Japanese chemical and materials ...

AblePrint Technology (APT), a supplier of pneumatic and thermal process solutions for semiconductor packaging, has reported ...

The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley. This ...

Stefan Chitoraga, Technology & Market Analyst, Semiconductor Packaging, Yole Group, added: "Advanced packaging increases chip area integration per component. However, integrating more chips into a ...

M (MMM) said it is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 ...

Amkor, an Arizona-based company, plans to invest $2 billion in the northwest Valley by building a state-of-the-art facility.