Infineon Technologies AG announces its 200 mm silicon carbide (SiC) manufacturing capability, with initial product releases ...
Source: EV Group. According to Dr. Thorsten Matthias, regional sales director Asia/Pacific for EV Group, “Accelerating the ...
The release to customers of the first SiC products based on the 200-millimeter wafer technology will be a substantial step forward in Infineon’s SiC roadmap, with a strong focus on providing customers ...
Hosted on MSN1mon
Silicon photonics advance paves the way for cost-effective, high-performance optical devicesHybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates ...
Hosted on MSN8mon
onsemi to invest up to $2B to build chip facility in Czech RepublicThe investment would build on onsemi's current operations in the Czech Republic, which include silicon crystal growth, silicon and silicon carbide wafer manufacturing and a silicon wafer fab.
Results that may be inaccessible to you are currently showing.
Hide inaccessible results
Feedback