South Korean memory makers SK Hynix and Samsung Electronics both saw their exports of multi-chip packages (MCP) fall ...
This integration of optical chiplets within multi-chip packages, increasingly becoming the norm in high-performance processors, could enable up to 25 times better off-package bandwidth compared to ...
utilising Altera’s Multi-Chip Package (MCP2) for expected use on the US Navy’s MH-60R multi-mission helicopter. The project was awarded through the Naval Surface Warfare Center (NSWC ...
May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...
As of July 8, each core of new multi-core AMD or Intel processors ... more compute-intensive CPUs that basically pack multiple chip capabilities on a single processor. Up until now, Redwood ...
We also propose a scalable multi-chip architecture which attains fully chip- and wordparallel Hamming distance search by taking advantage of the digital associative memories. We have designed and ...
A technical paper titled “Multi-dimensional data transmission using inverse-designed ... couplers to enable multimode optical transmission between separate silicon chips throughout a multimode-matched ...
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