Breaking complex chips into smaller pieces allows for much more customization, particularly for domain-specific applications, ...

New connectivity standard brings performance improvements and a bunch of new features, but it may take years before they are ...

The first mini PC to feature Intel's new Core Ultra processors (Series 2) along with Microsoft Copilot+ The Asus NUC 14 Pro ...

Apple in October 2024 overhauled its 14-inch and 16-inch MacBook Pro models, adding M4, M4 Pro, and M4 Max chips, Thunderbolt ...

Although multi-die designs — an increasingly popular approach for integrating heterogeneous and homogenous dies into a single package — help resolve problems related to chip manufacturing and yield, ...

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In 2.5D, these modular chips are placed on the package with very small balls of ... Significant defects in any one part of the multi-die system can be catastrophic, and as semiconductor companies ...

The complex multi-chip module design, which integrates two large GPU dies on a single package, further exacerbates the heat management challenges. As deployments scale, with configurations ...

The North America multi-chip package solution market is primarily driven by the increasing demand for high-performance and miniaturized electronic devices. As technology continues to evolve, there is ...

This chip has a 3GB capacity in the same package size as a 2GB chip ... but the card relies heavily on DLSS 4 Multi Frame Gen to really pull ahead of older cards. In our RTX 5080 review we ...

May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...