But speakers sometimes stumble during a presentation trying to figure out whether a particular die qualifies as a chiplet, ...

utilising Altera’s Multi-Chip Package (MCP2) for expected use on the US Navy’s MH-60R multi-mission helicopter. The project was awarded through the Naval Surface Warfare Center (NSWC ...

This integration of optical chiplets within multi-chip packages, increasingly becoming the norm in high-performance processors, could enable up to 25 times better off-package bandwidth compared to ...

To implement a UCIe die-to-die link, designers must address several critical multi-die health challenges, including: ...

While current chips support only 132 parameters compared to the trillion used in large language models, researchers suggest multi-chip systems could bridge this gap, potentially enabling more ...

May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...

We also propose a scalable multi-chip architecture which attains fully chip- and wordparallel Hamming distance search by taking advantage of the digital associative memories. We have designed and ...