Interesting Engineering on MSN

Record-breaking quantum semiconductor drives electrons at near-frictionless speeds

University of Warwick and National Research Council of Canada scientists achieve record-breaking electrical conductivity in ...
Semiconductor Engineering

The Thermal Trap: How Dielectrics Limit Device Performance

This coupling heavily influences performance and yield. Heat induces mechanical deformation, deformation alters carrier ...
Nanowerk

Germanium on silicon sets mobility record for next-generation chips

A strained germanium epilayer on silicon achieves a record hole mobility, enabling faster low-power electronics and scalable ...
Hosted on MSN

SK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centers

Leading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND flash. The super dense NAND chips which will power these UFS 4.1 ICs are ...
AZoM on MSN

How Multi-Scale Surface Metrology Enhances Hybrid Bonding in Semiconductor Packaging

Learn how Bruker’s InSight systems ensure pristine wafer surfaces, improving bond integrity and yield in advanced semiconductor packaging.
Tech Xplore on MSN

Rubber electronics are first to offer complementary metal–oxide–semiconductor functionality

Researcher Cunjiang Yu and his research team, including several of his former students, have announced a significant ...