Learn how Bruker’s InSight systems ensure pristine wafer surfaces, improving bond integrity and yield in advanced semiconductor packaging.
University of Warwick and National Research Council of Canada scientists achieve record-breaking electrical conductivity in ...
The Spanish government will invest 753 million euros ($868 million) in a new microchip manufacturing plant belonging to U.S. company Diamond Foundry in the western Extremadura region, government ...
Designing resilient chips with SLM can help combat aging effects, security threats, and get to market faster with higher ...
To address these challenges head-on, Siemens EDA offers the Calibre IP Checker, part of the Calibre Pattern Matching tool ...
2d
Record-setting charge mobility in germanium-silicon material points to energy-saving quantum chips
Most modern semiconductors are fabricated of or on silicon (Si), but as devices get smaller and denser, they dissipate more ...
A strained germanium epilayer on silicon achieves a record hole mobility, enabling faster low-power electronics and scalable ...
Abstract: Flip chip ball grid array (FC-BGA) packages are preferred in high-performance computing and advanced packages because of their superior signal integrity, high input/output density, good ...
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