Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four new national awards announced by ...

PanelSemi signed a memorandum of understanding (MOU) with Japan Display (JDI) to collaborate extensively in advanced ceramic ...

The board could also decide to build capacity in the U.S. for advanced packaging, which Taiwan Semiconductor has kept in Taiwan, FT cited unnamed sources familiar with the matter. Although North ...

He has achieved significant academic success, receiving 'Best Paper Awards' at over 20 international conferences, including IEEE. Vice President Lee is a top technical expert in the semiconductor ...

a group of 12 semiconductor suppliers focused on developing next-generation semiconductor advanced packaging and back-end processing technologies. Founded in 2023 by Japanese chemical and materials ...