TSMC plans to increase its investment in Arizona, expanding its fabs to cooperate with the 'manufacture in USA' policy pushed ...

A Wafer-Scale LLM Inference System” was published by researchers at University of Edinburgh and Microsoft Research. Abstract ...

Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly implemented new shipment restrictions on Chinese IC design ...

Semiconductor Packaging Market 2030 Semiconductor Packaging Market Expected to Reach $60.44 Billion by 2030 IoT products like senso ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

On the materials front, Global Wafers is constructing the first U.S ... Smaller firms lacking resources need government support to form a trade association. This group could provide legal advice ...

More than a dozen R&D centers were also established for 8-inch wafers, EUV, and advanced packaging. Investments came from both companies and government sources, and many CHIPS Act awards have now been ...

That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to ... along with an RDL interposer to form a reconstituted interposer (RI) to enhance chip ...

Renesas 100-V N-channel MOSFETs leverage an improved wafer manufacturing process with split gate technology, reducing on-resistance (R DS(on)) by 30%. The REXFET-1 process also cuts total gate charge ...

Key Laboratory for Micro-Nano Optoelectronic Devices of Ministry of Education, School of Physics and Electronics, Hunan University, Changsha 410082, China ...

which enable full wafer contact for testing and burning in of AI processors in wafer form before system integration. This achievement represents a significant technological and commercial ...