SEALSQ filed its Condensed Consolidated Financial Statements in the Form 20-F for the full year period ended December 31, 2024, with the U.S. Securities and Exchange Commission on March 20, 2025. The ...

Signaturefd LLC raised its stake in Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC – Free Report) by 35.5% during the 4th ...

Integrated circuits (ICs), also known as microchips or simply chips, are the cornerstone of modern electronics. These tiny marvels of engineering have revolutionized the way we live, work, and ...

Jiufengshan Laboratory (JFS) announced two major breakthroughs in GaN technology: the world's first 8-inch silicon-based ...

From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level ...

The team led by Delphine Bouilly, a professor in UdeM's Physics Department and director of IRIC's Electronic Nanobiosensor ...

Upgrades to Keysight’s double-pulse test systems bring easier and even higher-accuracy measurement of dynamic characteristics ...

EnSilica is pleased to announce that it has been awarded a multimillion-pound design and manufacturing services contract by a ...

Hundreds of regular patterns spontaneously emerge on a small germanium chip. A curiosity about tiny dots on a germanium wafer with metal films led to the discovery of intricate spiral patterns etched ...

The company offers ball bonding equipment, wafer level bonding equipment, wedge bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools ...