New Delhi, May 20, 2024 (GLOBE NEWSWIRE) -- The global wafer dicing services market stood at US$ 578.8 million in 2023. It is expected to reach US$ 838.9 million by 2032, growing at a moderate CAGR of ...
Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...
New York, May 19, 2022 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Thin Wafer Processing and Dicing Equipment Market - Growth, Trends ...
(MENAFN- EIN Presswire) Rest of Asia-Pacific segment contributed the major share in the thin wafer processing and dicing equipment market in 2021. The thin wafer processing and dicing equipment market ...
SAN JOSE — The chip industry's IC wafer fab utilization rate plunged to 72.7% of installed capacity in the second quarter from 83.8% in Q1 of this year, according to new statistics release by the ...
Orbotech Ltd. (NASDAQ: ORBK) announced that it has successfully closed the previously-announced acquisition of SPTS Technologies Group Limited ("SPTS"), in a strategic move into the high growth areas ...
TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...
SAN JOSE, Calif. – Corwil Technology Corp., a provider of contract assembly and wafer dicing services, today announced the acquisition of Disco Hi-Tec America's wafer thinning and polishing equipment ...
The supply of IC packaging production tools including polish grinders, wafer-dicing machines, and tape laminators has become severely tight, apart from delivery lead times lengthened for wire-bonding ...
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