June 25, 2014-- Semiconductor manufacturers closed 72 wafer fabs between 2009-2013 and another nine fabs are slated to close in 2014, according to data recently compiled, updated, and now available in ...

High volume 450mm IC wafer fabs not expected until after 2020. April 19, 2016 -- IC Insights recently released its new Global Wafer Capacity 2016-2020 report that provides in-depth detail, analyses, ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...