High volume 450mm IC wafer fabs not expected until after 2020. April 19, 2016 -- IC Insights recently released its new Global Wafer Capacity 2016-2020 report that provides in-depth detail, analyses, ...

and amalgamation of circuits onto the wafer. The outcome is an IC wafer prepared from the congregation into electronic gadgets. Semiconductor wafers are structuring the components of the electronic ...

LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that ...

These factors reduce the overall number of wafers an IC manufacturer can process in a given time, and also raise production costs per chip. Extreme ultraviolet lithography can achieve these ...