Semiconductor Engineering7d
UCIe For 1.6T Interconnects In Next-Gen I/O Chiplets For AI Data Centers
The AI cluster connects to the front-end networks via Ethernet through a network interface card (NIC), which can go up to ...
C&EN25d
Polymer-Free and Dry Patterning of Wafer-Scale Two-Dimensional Semiconductors via van der Waals Delamination
Key Laboratory for Micro-Nano Optoelectronic Devices of Ministry of Education, School of Physics and Electronics, Hunan University, Changsha 410082, China ...
Design-Reuse6y
92 IC Wafer Fabs Closed or Repurposed From 2009-2017
150mm and 200mm wafer fabs accounted for two-thirds of total closures. March 01, 2018 -- Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older ...
Design-Reuse8y
Number of 300mm IC Wafer Fabs Expected to Reach 100 in 2016
High volume 450mm IC wafer fabs not expected until after 2020. April 19, 2016 -- IC Insights recently released its new Global Wafer Capacity 2016-2020 report that provides in-depth detail, analyses, ...