Active interposers with transistors will gradually replace passive interposers, driving the transition to vertical stacking.

E Ink announced it has developed a new generation of advanced Electronic Shelf Label (ESL) demo design in partnership with ...

Malaysia’s semiconductor sector sees a boost with ARM’s US$250M investment, aiming for high-value chip design and advanced ...

The company has improved its chip-on-panel technology. Oppo is expected to launch additional Find X8 phones in April.

Working with MeitY to provide EDA tools to academia and startups, how does Cadence Design Systems benefit from this alliance?

TAIPEI (Taiwan News) — E Ink announced Wednesday its partnership with Realtek to launch a low-power electronic shelf label ...

This January 16 interim final rule by the US Department of Commerce’s Bureau of Industry and Security (BIS) imposes a broader license requirement ...

Cadence is expanding its collaboration with Intel Foundry by officially joining the Intel Foundry Accelerator Design Services Alliance!

Demand for advanced semiconductor foundry capacity will remain at an all-time high in 2025. Many leading industry analyst ...

Compute nodes in AI and HPC data centers increasingly need to reach out beyond the chip or package for additional resources ...

Hana RFID, Goodyear and Michelin have been working together on a variety of UHF RFID tire tags that identify tires on ...