Intel’s answer to these advanced packaging demands is Foveros. They’ve introduced new solutions, Foveros-B and Foveros-R, ...

A 32 kb instance is fabricated in 28-nm UTBB-FDSOI technology and efficiency of the proposed scheme is demonstrated with lowest write voltage of 0.32 V. Multiple read assist schemes have been used to ...

IBM introduced its new Power11 chips on Tuesday, marking its first major update to its "Power" line of chips since 2020 ...

This paper presents a 5-bit 1.25-GS/s folding flash ADC. The prototype achieves a folding factor of four with a capacitive folding technique that only consumes dynamic power. Incorporated with various ...