Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of ...

BOE, a leading Chinese manufacturer of LCD and OLED displays, is considering making glass core substrates for next-gen domestic chips.

Friday 6 September 2024 BOE reportedly seeks to mass-produce glass substrates for semiconductor packaging in 2026 China-based display solutions supplier BOE Technology has unveiled a roadmap for ...

Advanced IC substrates (AICS ... Simply put: are organic substrates up to the challenge? Fig. 1: The industry roadmap for the transition of substrates from organic (top) to glass (bottom) and the path ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

Competition for an early lead in glass substrates for computer chip manufacturing is heating up, with component firms ...

Focusses on Advanced IC-Substrates and Next Generation Wafer-Level Packaging ...

Glass substrates are also considered the most suitable technology for the application of chiplet packaging, which is seen as a future technology in the semiconductor market. Chiplets allow for ...

One will go to Absolics Inc. in Covington, Georgia, to support the company’s research in glass-core packaging, which focuses on reducing power consumption and the complexity of semiconductor systems ...

The company plans to launch a pilot production line for glass core substrates in the second ... and the stringent precision demands of semiconductor packaging mean that significant research ...