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Electron microscopy shows 'mouse bite' defects in semiconductors

Cornell researchers have used high-resolution 3D imaging to detect, for the first time, the atomic-scale defects in computer chips that can sabotage their performance. The imaging method, which was ...
Semiconductor Engineering

Redefining Backside Metallization: Low‑Temperature Solutions For HDFO And S‑SWIFT Designs

However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and ...
National Academies of Sciences%2c Engineering%2c and Medicine

Materials for High-Temperature Semiconductor Devices

Unfortunately, this book can't be printed from the OpenBook. If you need to print pages from this book, we recommend downloading it as a PDF. Visit NAP.edu/10766 to get more information about this ...