The framework would divide the world into AI “haves” and “have nots,” based on nations’ willingness to align with the U.S.

Sheet Bonding Material That Allows Bonding of High-Current Large Silicon (Si) Chips In recent years, there has been rising demand for high-current power semiconductors centered on applications ...

Released today (January 13), the Interim Final Rule on Artificial Intelligence Diffusion restricts the access of AI ... 2024 and have attracted widespread criticism from across the semiconductor ...

This industry application has become more difficult in recent years due to regulatory and market pressure to increase ...

The export controls on AI Diffusion are scheduled to take effect ... President of the India Electronics and Semiconductor Association (IESA). “India should invest in designing AI-specific ...

Amid criticism from Nvidia and various technology advocacy groups, a US official has defended President Joe Biden’s recently announced artificial intelligence diffusion rules, which are aimed at ...

"We see that 2025 is likely the peak [wafer fab equipment], as we believe the current semiconductor upcycle will be lukewarm, and the next downturn could hit in 2H26," analyst Charles Shi wrote in ...

While this helps the US maintain control over sensitive technologies, it also deepens the divide between the US and China, intensifying competition in AI and semiconductors. Malaysia’s Position in AI ...

The analyst highlighted concerns about the current semiconductor upcycle’s weakness and a possible downturn in the second half of 2026. Nonetheless, he believes that due to its exposure to TSMC ...