Die bonding, alternatively known as die attaching is the process of bonding or attaching a chip either to a package or to some substrate. Thus, die bonder equipment is used extensively in the ...

The die bonding process plays a crucial role in semiconductor chip manufacturing. It involves detaching the chip from the carrier and attaching it to the packaging substrate.

According to the report, the die bonder equipment market size was valued at $785.2 million in 2023, and is estimated to reach $1.9 billion by 2032, growing at a CAGR of 10.8% from 2024 to 2032.

The global die bonder equipment market size is projected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% from 2019 to 2024.

The die bonding process precedes the wire bonding step in semiconductor chip manufacturing, and normally utilizes adjacent floor space and a common engineering team.

EMS provider Escatec has integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes. The company has built a customised ...

Report Ocean has published a new report on the Die Bonder Equipment Market, delivering an extensive analysis of key factors such as market restraints, drivers, and opportunities. The report offers a ...

This report segments the die bonder equipment market comprehensively and provides the closest approximations of the overall size of the market, as well as its segments and subsegments. 2.