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Header Die & Tool makes dies and tools for many different industries, and they’ve done so for more than 70 years. “Everyday ...
Hybrid bonding is being evaluated for advanced packaging of 2.5 and 3D modules due to the enhanced scalability and performance (thermal, electrical and reliability) of the interconnect. The direct ...
Advanced packaging is becoming a key differentiator for the high end of the mobile phone market, enabling higher performance, ...
In this paper the stacking process development and the characterizations of multi-die stacks N=16, which contain 15 thinned top dies on a bottom die, are described. A comparison study between ...