GlobalFoundries, a semiconductor ... “Thanks to my bipartisan CHIPS & Science Law, GlobalFoundries now plans to build a first-of-its-kind advanced chip Packaging and Photonics Center right ...
It will combine 300mm silicon wafer research and prototyping for front-end manufacturing and chip packaging capabilities, playing a critical role in advancing semiconductor innovation across the ...
GlobalFoundries is now planning to build a $575 million chip ... packaging and testing center, which will have a special focus on photonics, which is the use of pulses of light within a ...
Forward-looking: The Department of Commerce has announced $1.4 billion in awards through the CHIPS National Advanced Packaging Manufacturing Program. While this initiative will contribute to ...
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