SINGAPORE--A new consortium has been established to advance the country's next-generation 300mm wafer manufacturing capabilities, by focusing on a technology for three-dimensional integrated circuits ...

In another step towards driving the maturity of 3D IC integration, SEMATECH's 3D Interconnect program announced today the completion of its 300mm 3D IC pilot line, operating at the College of ...

In this article we look at the Lam Research Coronus DX edge bevel deposition announcement to increase yield of semiconductor wafers after complex processes, such as during the creation of 3D NAND.

Aledia, a French startup pioneering a disruptive technology for microLED displays, today announced it has manufactured the world’s first microLED chips produced on 300mm (12in) silicon wafers. The ...

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What just happened? Texas Instruments announced it will build 300mm wafer fabrication plants in Sherman, Texas, to tackle the increasing demand for semiconductors worldwide. Construction of the first ...