Wafer-scale accelerators for AI applications can deliver far more computing power with much greater energy efficiency.

Innovative power supply technology for 3D-integrated chips improves energy efficiency and reduces noise, addressing the ...

DAC's AI focus; 300mm fab report; foundry revenue; new auto chip org.; Micron earnings; rare earth exports plummet; UK's tech ...

ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged ...

Texas Instruments is already building a second 300mm wafer fab in Utah while upping the output of an existing facility at the site, with the pair to ultimately be connected. The US government welcomed ...

The global Electrostatic Chucks (ESCs) market is witnessing robust expansion, with its valuation projected to rise from US$ 1.99 Bn in 2025 to US$ 3.40 Bn by 2032, growing at a CAGR of 7.9%. The ...

Texas Instruments plans to invest $60 billion to expand U.S. chip manufacturing, creating 60,000 jobs. Apple, Ford, Medtronic, NVIDIA, and SpaceX support the initiative.

Now, TI is planning to spend $60 billion to build or expand seven chip-making facilities at three sites in Texas and Utah, including two new facilities in Sherman, Texas. “TI is building dependable, ...

CEO Haviv Ilan emphasized that TI is scaling up dependable, low-cost 300mm wafer production to ensure stable supply of chips vital to a wide range of electronic systems.

This follows RFAB1, the world’s first 300mm analogue factory, opened in 2011. In Lehi, Utah, the company is ramping up LFAB1, its first 300mm wafer factory.