Direct wafer bonding of wafers is now well establish. However in many interesting applications, direct bonding of die to wafer can lead to innovative devices. After explaining some specific ...

DAC's AI focus; 300mm fab report; foundry revenue; new auto chip org.; Micron earnings; rare earth exports plummet; UK's tech ...

Methods based on 3D Gaussian Splatting (3DGS) for surface reconstruction face challenges when applied to large-scale scenes captured by UAV. Because the number of 3D Gaussians increases dramatically, ...

According to the 300mm Fab Outlook report, the global semiconductor manufacturing industry is expected to maintain strong ...