China has established the Beijing Yandong Microelectronics (YDME) semiconductor company, destined to operate a 300mm fab that will cost around $4.6 billion to get up and running. The chipmaker ...

MILPITAS, Calif. — March 20, 2024 — Global 300mm fab equipment spending for front-end facilities is forecast to reach a record US$137 billion in 2027 after topping US$100 billion for the first time by ...

The projects in Malta, New York include constructing a new 300mm fab and expanding the existing facility, which includes a strategic agreement with General Motors. These projects aim to triple ...

To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor owns two facilities in Israel (150mm and 200mm), two in the U.S. (200mm), two in Japan (200mm and 300mm ...

Electronics Engineering Herald is an online magazine for electronic engineers with focus on hardware design, embedded, VLSI, ...

Initial production slated for 2027, expected output of 55,000 300mm wafers per month in 2029 VSMC Celebrates Breaking Ground on 300mm Fab in Singapore The event was attended by (from left to right ...

The CHIPS Act direct funding will support TI's investments through 2029 for three large-scale 300mm wafer fabs in Sherman ... Shell construction of SM2, a second fab in Sherman, Texas; and Cleanroom ...

MILPITAS, Calif. — June 14, 2023 — Global 300mm fab equipment spending for front-end facilities next year is expected to begin a growth streak to a US$119 billion record high in 2026 following a ...

Initial production slated for 2027, expected output of 55,000 300mm wafers per month in 2029 VSMC Celebrates Breaking Ground on 300mm Fab in Singapore The event was attended by (from left to right ...