The real-time and accurate temperature monitoring is very important for strictly controlling the wafer temperature in the process of integrated circuits (IC) manufacturing, which is conductive to the ...

The emerging wafer-level packaging (WLP) technology suffers from serious signal integrity (SI) and power integrity (PI) issues due to its redistribution layer (RDL). There exhibit serious parasitic ...

Infineon has announced that its scalable GaN manufacturing on 300mm wafers is on track, with first samples available for ...