A new technical paper titled “Customizing a Large Language Model for VHDL Design of High-Performance Microprocessors” was ...

The semiconductor industry is undergoing a fundamental shift from monolithic chip designs to chiplet-based architectures.

The researchers used it to map stray magnetic fields from CoFeB–SiO2 thin films used in high-frequency inductors. They ...

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at ...

New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.

Data centers and cloud computing need multi-core and multi-socket scalability. And while the basic building blocks can be ...

A new technical paper titled “What Is Next for LLMs? Next-Generation AI Computing Hardware Using Photonic Chips” was ...

PMJ 2025 was more than just a successful event—it was a clear signal that the photomask and eBeam communities are growing, ...

A new technical paper titled “Enabling static random-access memory cell scaling with monolithic 3D integration of 2D ...

A new technical paper titled “Josephson Junctions in the Age of Quantum Discovery” was published by researchers at Lawrence ...

Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; ...

How much value does DAC really add to the industry? Large EDA companies may be ignoring some of the benefits.