New reports on U.S. IC chemicals and materials availability; China export blacklist expands; global fab equipment report; ...

L-R: Cadence’s Young; Synopsys’ Stahl; Siemens’ Munsey; ChipAgents’ Wang; Theodore Wilson. SE: What is a digital twin in the ...

The chip industry is exploring multiple avenues for simplifying multi-die integration, but difficulties remain for optimizing ...

Number of designs that are late increases. Rapidly rising complexity is the leading cause, but tools, training, and workflows ...

Verifying the functionality of a full multi-chip system, including digital controllers, analog electrical, and photonic ...

The founders of EDA are retiring, and perhaps it’s time that EDA headed off in a different direction.

A new technical paper titled “Revisiting DRAM Read Disturbance: Identifying Inconsistencies Between Experimental ...

A new technical paper titled “Hardware Implementation of Ring Oscillator Networks Coupled by BEOL Integrated ReRAM for ...

The semiconductor industry is on the brink of a major transformation. While AI-driven verification and connected workflows ...

D materials in 3D transistors; electrochemical memristive mechanism; matching substrates for power electronics.

A new technical paper titled “CATCH: a Cost Analysis Tool for Co-optimization of chiplet-based Heterogeneous systems” was ...

A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level ...