And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

We recently published a list of 10 AI Stocks on Wall Street’s Radar. In this article, we are going to take a look at where Aehr Test Systems, Inc. (NASDAQ:AEHR) stands against other AI stocks on Wall ...

Aehr is now the only company offering both wafer-level and package-level test and burn-in solutions for AI processors. Gayn Erickson, President and CEO of Aehr Test Systems remarked: "With this ...

Meanwhile, there are other relative newcomers in fan-out, namely from China. For example, Jiangyin Changdian Advanced Packaging (JCAP) has a wafer-level package. JCAP is part of Jiangsu Changjiang ...

and high-density wafer-level RDL-based Integrated Fan-Out (InFO-R) designs. 3DIC Compiler provides packaging design solutions required by today's complex multi-die systems for applications like ...