New Delhi, May 20, 2024 (GLOBE NEWSWIRE) -- The global wafer dicing services market stood at US$ 578.8 million in 2023. It is expected to reach US$ 838.9 million by 2032, growing at a moderate ...

“Advanced wafer nodes make use of dies with very fragile and brittle materials. And as a consequence, these materials are more subject to cracking and breaking during the dicing process. Some new ...

How Does Fonon BlackStar Maximize Wafer Dicing Yield? Fonon Corporation’s laser-powered BlackStar Wafer Dicing System helps semiconductor fabricators eliminate defects, distortions, cracks and ...

ORLANDO, Fla., March 29, 2024--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...

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Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...

Wafer Stealth Dicing / Motion Control for Laser Based Semiconductor Wafer Dicing. 5-DOF Stage for Wafer Stealth Dicing / Semiconductor Wafer Dicing. Video Credit: PI (Physik Instrumente) LP ...