Discover how physical AI unlocks economic value by balancing advanced machine intelligence with strict SWaP-C engineering ...

A*STAR and MetaOptics developed a process to fabricate titanium dioxide (TiO₂) metalenses on 300-mm glass wafers using DUV ...

Applied Materials' $5B EPIC Center aims to accelerate semiconductor R&D, driving market share, AI innovation, and $12B+ ...

Choose timing with confidence: compare crystals, oscillators, RTCs, MEMS, and atomic references for reliable designs—download ...

Qualcomm’s Chris Lattner says AI agents can optimize kernels but can’t replace software engineering or build dependable chip ...

The Qualcomm Arm verdict is the latest chapter in a four-year IP dispute between the two chip giants about claims on license ...

This year’s Nobel prizes linked large systems to their smallest parts. What can chip design learn, and can AI help reverse ...

Explore OCP Global Summit 2026 breakthroughs: high-voltage 800 V DC-to-12 V power boards, advanced server PSUs, and isolated ...

At Ayar Labs CPO Summit, Meta, Broadcom, AMD, and others weighed in on readiness for a 2028 co-packaged optics demand surge ...

A trillion-dollar industry driven by AI and quantum computing, with Zeiss inspection tech and advanced packaging innovations.

In a bid to secure domestic deep-tech infrastructure, Qilimanjaro closed €19.6 million (~$21.3 million) funding led by Indra ...

GlobalFoundries secures a $21B U.S.-Japan partnership to build two New York fabs, boosting U.S. chip production by 10% amid ...