The market currently experiences rapid technological bifurcation where mechanical methods handle standard output while advanced laser solutions address the burgeoning demand for ultra-thin AI-grade ...

– SCHMID accompanies production change-over and takes care of downstream processes. The wafers of the future are getting thinner and thinner and already approaching a thickness of 140 µm. The slurry ...

Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...

US-based wafer producer 1366 Technologies and ‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS have announced a new cells record of 20.3% using direct wafer technology. The pair also ...

Inari Amertron Bhd. is an investment holding company, which through its subsidiaries provides OSAT niche services in Radio Frequency System in Package for smart mobile devices, fiber-optic transceiver ...

Semiconductors guarantee high resistance, low cost, and reliability when used in electronic circuits. To manufacture semiconductor devices, multiple photographic and chemical-processing steps are ...

A trio of companies is attempting to reduce the waste caused by wafer-sawing processes by growing crystalline silicon on relatively cheap foil. NREL has teamed up with DOE's Oak Ridge National ...

Scientists in China have investigated the fracture strength of commercial G12 monocrystalline wafers via the 4-point bending test and have found that wafer thickness, the position of the silicon wafer ...

DUBLIN--(BUSINESS WIRE)--The "Global Wafer Dicing Saws Market 2017-2021" report has been added to Research and Markets' offering. The global wafer dicing saws market to grow at a CAGR of 6.35% during ...

Dr. Davor Sutija is the CEO of NexWafe, a solar photovoltaic company establishing a new standard for the future of engineered green wafers. With the advent of the United States’ first-ever clean ...