– SCHMID accompanies production change-over and takes care of downstream processes. The wafers of the future are getting thinner and thinner and already approaching a thickness of 140 µm. The slurry ...

Product Briefing Outline: Due to technology partnerships and longtime experience RENA has been able to optimize the handling and process sequence for the complete process chain after wafer sawing with ...

The complete wafer saw solution includes: DISCO’s fully automatic dicing saw for high-throughput, dual-cut processing, DISCO’s ablation laser saw and stealth dicing saw, Rudolph’s NSX ® inspection ...

The "Thin Wafer Market Report 2026" has been added to ResearchAndMarkets.com's offering.The thin wafer market is experiencing robust growth, poised to expand from $12.57 billion in 2025 to $19.45 ...

A new process for cutting silicon wafers could streamline the production of smaller and more powerful microchips for electronic devices. A new process for cutting silicon wafers could streamline the ...

Semiconductors guarantee high resistance, low cost, and reliability when used in electronic circuits. To manufacture semiconductor devices, multiple photographic and chemical-processing steps are ...

Scientists in China have investigated the fracture strength of commercial G12 monocrystalline wafers via the 4-point bending test and have found that wafer thickness, the position of the silicon wafer ...

DUBLIN--(BUSINESS WIRE)--The "Global Wafer Dicing Saws Market 2017-2021" report has been added to Research and Markets' offering. The global wafer dicing saws market to grow at a CAGR of 6.35% during ...